独電気電子工業会(ZVEI)は19日、ドイツの電子部品市場規模が今年は前年比8.5%増の196億ユーロに拡大するとの予測を発表した。主力の半導体が11.5%増の123億ユーロとなり全体をけん引。プリント基板も8.3%増の15億ユーロと大きく伸びる。膜集積回路(FIC、Integrierte Schichtschaltung)は2%減の5億4,600万ユーロに後退する。(下のグラフ参照)
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